Quote:
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XFX implemented the area surrounding the CPU socket exquisitely, using low profile components that did not impair CPU cooler placement during the board test runs. The CPU cooler hold down mechanism is based on the LGA775 standard 4-hole implementation. The board’s Northbridge chipset is located to the left of the CPU, covered by an actively cooled large thin-finned copper heat sink. The sink sits in the middle of the onboard heat pipe cooling mechanism, acting as the one of the main heat dissipation areas. Above the CPU is one end of the heat pipe in the form of a large thin-finned heat sink, sitting atop the CPU power circuitry. The Northbridge fan header is to the left of this heat sink assembly, while the 8-pin ATX12V power connector is to its right. The 4-pin CPU fan header is located to the lower right of the CPU socket, along the board’s edge.
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I don't think the CPU heatsink/fan can be rotated. However, take a look at this picture:
It shows that the fan on the cooler over the Northbridge blows air into the CPU cooler airstream, which should then be pushed out of the back of the case.